Etchant composition and method of manufacturing wiring substrate using the same
US10941342B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 9, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Jul 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32134
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An etchant composition may include: a peroxosulfate; a cyclic amine compound; a first amphoteric compound including a carboxyl group; and a second amphoteric compound including a sulfone group, wherein the second amphoteric compound may be different from the first amphoteric compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.