Patent · US Active

Integrated electrical and optoelectronic package

US10942324B2 · kind B2 · utility

3Cited by

7References

28Claims

0Family size

Assignee

CORNING OPTICAL COMMUNICATIONS LLC · US

Inventors

Alan Frank Evans · Corning, US
Andreas Matiss · Berlin, DE
Michael Wimmer · Bremen, DE

Key dates

Filing date	Aug 28, 2019
Grant date	Mar 9, 2021
Priority date	—
Expiry date	Aug 28, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/428
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.