Photosensitive resin composition and cured film prepared therefrom
US10942449B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Oct 5, 2017 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Oct 5, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/04
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.