Format for multi-artefact software packages
US10942723B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Apr 5, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F8/71
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an example embodiment, a solution is used to provide for a highly efficient application installer. A software packaging format, known as vSolution, is provided that allows software developers to ship multiple artefacts of different types in a single container. Unlike traditional mechanisms, this container does not contain a dedicated installer executable or any sort of installation routine. Rather, the container format encourages a declarative approach to describe what an installation routine should perform, via the organization of the artefacts based on content type and using a naming convention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.