Method of manufacturing a multilayer ceramic electronic component with improved withstand voltage characteristics
US10943736B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Apr 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a multilayer ceramic electronic component which includes preparing first and second ceramic green sheets; forming an internal electrode pattern on the first ceramic green sheet using a conductive metal paste; forming a ceramic member on first and second end portions of a first surface of the second ceramic green sheet to form a step portion absorption layer; stacking two or more of the first ceramic green sheets on each other in a stacking direction to form a first group; stacking two or more of the first ceramic green sheets on each other in the stacking direction to form a second group; and placing the second ceramic green sheet between the first group and the second group in the stacking direction to form a ceramic body, wherein the first and second end portions oppose each other in a first direction perpendicular to the stacking direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.