Sputtering arrangement and sputtering method for optimized distribution of the energy flow
US10943774B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Nov 14, 2016 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Oct 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3444
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a sputtering arrangement, a vacuum coating system, and a method for carrying out HiPIMS coating methods; the sputtering arrangement has at least two different interconnection possibilities and the switch to the second interconnection possibility, in which two sputtering sub-assemblies are operated simultaneously with high power pulses, achieves a productivity gain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.