Resin package and light-emitting device
US10944035B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2020 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Jan 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.