3-D printing process for forming flat panel array antenna
US10944182B2 · kind B2 · utility
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1References
13Claims
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Key dates
| Filing date | Feb 21, 2017 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Jan 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/064
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method of forming a flat panel array antenna includes the steps of: (a) providing a digitized design for a flat panel array, the flat panel array comprising a plurality of geometric features that vary in area along a thickness dimension of the flat panel array; (b) subdividing the digitized design into a plurality of thin strata stacked in the thickness dimension; (c) forming a thin layer of material corresponding to one of the thin strata; (d) fixing the thin layer of material; and (e) repeating steps (c) and (d) to form a flat panel array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.