Invisible headliner microphone
US10945060B2 · kind B2 · utility
5Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Nov 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.