Inner module used in a wireless earphone
US10945064B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | May 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10083
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An inner module used in a wireless earphone is installed primarily in a wireless earphone, including a circuit loop and an upper cover. The circuit loop includes at least a first circuit board, at least a second circuit board which is extended from the first circuit board, and a lower cover which encloses the first circuit board. The upper cover is installed on the lower cover, including a first side wall which forms an angle with respect to the lower cover. In addition, the first side wall is provided with a first positioning slot to accommodate the second circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.