Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies
US10945333B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Nov 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Thermal management assemblies for cooling an electronic assembly disposed on a PCB are disclosed. The thermal management assembly includes a heatsink, a heatsink manifold formed through the heatsink and a thermal compensation base layer coupled to the heatsink. The heatsink manifold has a fluid inlet and a fluid outlet. The thermal compensation base layer thermally connects the heatsink and the electronic assembly. The thermal management assembly further includes a cooling manifold disposed through the PCB to form a fluid flow path. Two or more electrically insulated posts are disposed between the heatsink manifold and the cooling manifold. Individual electrically insulated posts have a vertical cooling channel. At least one electrically insulated post fluidly connects the fluid inlet to the cooling manifold to form an upward fluid path. At least one electrically insulated post fluidly connects the cooling manifold to the fluid outlet to form a downward fluid path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.