High-density soft-matter electronics
US10945339B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2016 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Feb 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.