Mechanism with folded wrapping to seal components immersed in coolant
US10945353B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Jul 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/44
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.