Lamination molding apparatus
US10946558B2 · kind B2 · utility
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3References
8Claims
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Key dates
| Filing date | May 19, 2017 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Jan 16, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A lamination molding apparatus including a chamber covering a molding region; a laser beam source to emit a laser beam for sintering a material powder supplied on the molding region to form a sintered layer; and a scan unit to scan the laser beam. The laser beam has one or more spot shapes including at least an elongated shape, and the scan unit is configured to scan the laser beam, of which the spot shape is an elongated shape, in a lateral direction of the elongated shape, is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.