Decoy security based on stress-engineered substrates
US10947150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2018 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Dec 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. At least one functional device is disposed on the stress-engineered substrate. The stress-engineered substrate is configured to fracture in response to energy applied to the substrate. Fracturing the stress-engineered substrate also fractures the functional device. The system includes at least one decoy device. Fragments of the decoy device are configured to obscure one or more physical characteristics of the functional device and/or one or more functional characteristics of the functional device after the functional device is fractured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.