Adhesive composition comprising eutectic metal alloy nanoparticles
US10947424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Feb 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.