Patent · US Active

Photonic component and method for production thereof

US10948666B2 · kind B2 · utility

1Cited by

0References

34Claims

0Family size

Assignee

SICOYA GMBH · DE

Inventors

Stefan Meister · Berlin, DE
Moritz Grehn · Berlin, DE
Sven Otte · Hohen Neuendorf, DE
Sebastian Höll · Roth, DE

Key dates

Filing date	May 2, 2018
Grant date	Mar 16, 2021
Priority date	—
Expiry date	May 2, 2038

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/428
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.