Photosensitive resin composition
US10948821B2 · kind B2 · utility
2Cited by
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6Claims
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Key dates
| Filing date | Mar 24, 2017 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Aug 22, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L65/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition includes an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B) which constitutes a polyfunctional (meth)acryl group-containing silane condensate (B1) having a weight average molecular weight of 1,000 to 20,000, and having a plurality of structures represented by Formula (1), which is a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.