Input device manufacturing method and input device
US10949043B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Nov 14, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An input device manufacturing method according to an aspect of the present invention includes a lamination step of preparing a first substrate formed from a flat plate of a translucent synthetic resin, a second substrate formed from a flat plate of a translucent synthetic resin, and a sensor film formed from a translucent resin film on which a translucent electrode is disposed, and holding the sensor film between the first substrate and the second substrate to form a flat multilayer body; and a bending step of bending the flat multilayer body into a curved multilayer body retaining a curved shape. Thus, the input device can secure sufficient adhesion between the substrates and the sensor film, and can retain high detection accuracy with the sensor film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.