Die carrier package and method of forming same
US10950511B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2018 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Oct 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.