Protected electronic integrated circuit chip
US10950559B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 10, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Jun 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F55/255
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic integrated circuit chip includes a semiconductor substrate with a front side and a back side. A first reflective shield is positioned adjacent the front side of the semiconductor substrate and a second reflective shield is positioned adjacent the back side of the semiconductor substrate. Photons are emitted by a photon source to pass through the semiconductor substrate and bounce off the first and second reflective shields to reach a photon detector at the front side of the semiconductor substrate. The detected photons are processed in order to determine whether to issue an alert indicating the existence of an attack on the electronic integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.