High frequency module and communication device
US10950569B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Oct 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B2001/0408
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.