Patent · US Active

Sensor having system-in-package module, method for producing the same, and sensor arrangement

US10950574B2 · kind B2 · utility

0Cited by

9References

18Claims

0Family size

Assignee

Continental Teves AG & Co. OHG · DE

Inventors

Manfred Goll · Glauburg, DE
Martin Haverkamp · Frankfurt am Main, DE
Michael Schulmeister · Geiselhöring, DE

Key dates

Filing date	Jun 2, 2017
Grant date	Mar 16, 2021
Priority date	—
Expiry date	Jun 2, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10318
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A sensor including a system-in-package module, wherein electrical contacts can be contact-connected by way of a mating connector. An associated method and an associated sensor arrangement are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.