Method for producing at least one optoelectronic component, and optoelectronic component

US10950765B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Markus Pindl · Tegernheim, DE
• Markus Burger · Regensburg, DE
• Markus Boss · Regensburg, DE
• Matthias Lermer · Regensburg, DE

Key dates

• Filing date: Mar 6, 2018
• Grant date: Mar 16, 2021
• Expiry date: Mar 6, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362

Abstract

A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.