Camera module and photosensitive assembly thereof
US10951801B2 · kind B2 · utility
0Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2018 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Sep 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photosensitive assembly includes a circuit board, photosensitive chip coupled to the circuit board, the photosensitive chip includes a photosensitive area on an upper surface thereof and a non-photosensitive area surrounding the photosensitive area, and a package body packaged on the circuit board and covering a portion of the non-photosensitive area of the photosensitive chip, the package body includes an inner surface, and the inner surface has a curved surface on an edge thereof contacting the non-photosensitive area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.