Cable assembly for in-molded electronics assembly
US10952323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Jul 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.