Semiconductor module
US10952327B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Jan 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.