Patent · US Active

Sensor production by holding the intermediate injection-molded part

US10953578B2 · kind B2 · utility

1Cited by

7References

9Claims

0Family size

Assignee

Continental Teves AG & Co. OHG · DE

Inventors

Thomas H. Fischer · Wenden, DE
Lothar Biebricher · Oberursel, DE
Jakob Schillinger · Gaimersheim, DE
Dietmar Huber · Annaberg-Buchholz, DE
Michael Schulmeister · Geiselhöring, DE
Stefan Günthner · Frankfurt am Main, DE

Key dates

Filing date	Nov 27, 2014
Grant date	Mar 23, 2021
Priority date	—
Expiry date	Dec 11, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/3481
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.