Polyimide precursor composition
US10954340B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 8, 2016 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Jan 23, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide precursor composition that exhibits excellent tensile strength and breaking elongation, and that provides a film containing an alicyclic polyimide resin; a method for producing a polyimide film using the polyimide precursor composition; and a permanent film that contains an alicyclic polyimide resin and that exhibits excellent tensile strength and breaking elongation. The polyimide precursor composition is a mixture of a resin precursor component which is a polyamic acid including an alicyclic backbone having a predetermined structure, a monomer component that includes an aromatic diamine compound having a predetermined structure or an alicyclic tetracarboxylic acid di-anhydride having a predetermined structure; an imidazole compound having a predetermined structure; and a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.