Soluble material for three-dimensional molding
US10954378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2015 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Oct 15, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The soluble material for three-dimensional modeling of the present invention is a soluble material for three-dimensional modeling that is used as a material of a support material that supports a three-dimensional object when manufacturing the three-dimensional object with a fused deposition modeling type 3D printer. The soluble material for three-dimensional modeling contains at least one polymer and at least one filler. In the soluble material for three-dimensional modeling, the filler is a fibrous filler having a fiber length of 0.02 μm to 1,000 μm and a fiber diameter of 0.0001 μm to 20 μm and/or a flat filler having a particle size of 0.1 μm to 20 μm and a thickness of 0.01 μm to 10 μm. The content of the filler is 0.01 part by mass to 200 parts by mass with respect to 100 parts by mass of the polymer. According to the present invention, foaming and a decrease of the accuracy of a three-dimensional object can be suppressed even when the soluble material for three-dimensional modeling is used in manufacture of the three-dimensional object with a 3D printer after being exposed to high humidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.