Soldering quality detection platform
US10955363B2 · kind B2 · utility
3Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Feb 22, 2019 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Feb 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.