Power supply dry disconnect liquid cooling
US10955883B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2019 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Oct 15, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.