Enclosure with tamper respondent sensor
US10956623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Mar 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/88
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.