Land grid array patterns for modular electronics platforms and methods of performing the same
US10957660B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2019 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Dec 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15313
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.