Module and method of manufacturing module
US10958860B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2019 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Jul 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.