Patent · US Active

Over-torque protection features for mounting an electronic device to a heat dissipation object

US10959323B1 · kind B1 · utility

0Cited by

11References

35Claims

0Family size

Assignee

Performance Motion Devices, Inc. · US

Inventors

Emanuel Gustav Lewin · Lincoln, US
Steven M. Johnson · Westford, US
Arthur R. Nigro · Hopkinton, US
Peng Li · Beijing, CN
Peter F. Vandermeulen · Newburyport, US
Prabhakar Gowrisankaran · Andover, US
Andrew Colletta · Westford, US
Ahmad R. Shouman · Las Cruces, US

Key dates

Filing date	Oct 28, 2019
Grant date	Mar 23, 2021
Priority date	—
Expiry date	Oct 28, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A package for securing a PCB to a heatsink includes mounts with over-torque protection features. The PCB is seated in an open end of the package. Each mount includes a threaded opening for securing the package to the heatsink such that the base layer of the PCB is thermally coupled to the heat sink. The over-torque protection features are connected between the threaded opening and a sidewall of the package. The over-torque protection features may be designed to structurally fail and/or deform in response to over-torqueing of the fasteners, thereby inhibiting flexure of the PCB.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.