Scarring reducing wound treatment
US10960055B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2020 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Jun 23, 2040 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61Q19/00
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Undue scarring of healing wounds is decreased and/or the relapse rate of wounds is lowered by applying a composition that includes hemoglobin to the wound area. At least 40% of the hemoglobin in the composition is provided in CO-charged form.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.