Low profile head-located neurostimulator and method of fabrication
US10960215B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2018 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3758
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for subcutaneously treating pain in a patient includes first providing a neurostimulator with an IPG body and at least a primary, a secondary, and a tertiary integral lead with electrodes disposed thereon. A primary incision is opened to expose the subcutaneous region below the dermis in a selected portion of the body. A pocket is then opened for the IPG through the primary incision and the integral leads are inserted through the primary incision and routed subcutaneously to desired nerve regions along desired paths. The IPG is disposed in the pocket through the primary incision. The primary incision is then closed and the IPG and the electrodes activated to provide localized stimulation to the desired nerve regions and at least three of the nerves associated therewith to achieve a desired pain reduction response from the patient.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.