Polishing slurry, method of manufacturing the same, and method of manufacturing semiconductor device
US10961414B2 · kind B2 · utility
0Cited by
10References
15Claims
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Key dates
| Filing date | May 24, 2019 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | May 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing slurry including a composite including a hydrophilic fullerene and an ionic compound, a method of manufacturing the same, and a method of manufacturing a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.