Method for manufacturing floor panels and floor panel for forming a floor covering
US10961721B2 · kind B2 · utility
5Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2016 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Aug 23, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2607/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method for manufacturing floor panels, where the floor panels include a carrier on the basis of thermoplastic material and a top layer provided on the carrier; and where the method further includes at least the steps of strewing the thermoplastic material and consolidating the strewn thermoplastic material; where the thermoplastic material is strewn as a dry-blend.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.