Patent · US Active

Method for manufacturing floor panels and floor panel for forming a floor covering

US10961721B2 · kind B2 · utility

5Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 13, 2016
Grant dateMar 30, 2021
Priority date
Expiry dateAug 23, 2037

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2607/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Method for manufacturing floor panels, where the floor panels include a carrier on the basis of thermoplastic material and a top layer provided on the carrier; and where the method further includes at least the steps of strewing the thermoplastic material and consolidating the strewn thermoplastic material; where the thermoplastic material is strewn as a dry-blend.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.