Heat pump apparatus
US10962267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2016 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Oct 10, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2600/2525
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump apparatus includes: a refrigerant circuit configured to circulate refrigerant having flammability; a heat medium circuit configured to allow a heat medium to flow therethrough; a heat-medium heat exchanger configured to exchange heat between the refrigerant and the heat medium; an outdoor unit configured to accommodate the refrigerant circuit and the heat-medium heat exchanger; and an indoor unit configured to accommodate a part of the heat medium circuit, the outdoor unit including a refrigerant release valve, the refrigerant release valve being at least one of a pressure relief valve and an air purge valve which are provided in the heat medium circuit, the refrigerant release valve being provided outside a casing of the outdoor unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.