Patent · US Active

Co-packaged optics and transceiver

US10962728B2 · kind B2 · utility

17Cited by

9References

20Claims

0Family size

Assignee

Rockley Photonics Limited · GB

Inventors

David Arlo Nelson · Fort Collins, US
Seungjae Lee · Paju-si, KR
Brett Michael Dunn Sawyer · Pasadena, US

Key dates

Filing date	Mar 19, 2020
Grant date	Mar 30, 2021
Priority date	—
Expiry date	Mar 19, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10F77/933
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.