Adhesive bonded micro electro mechanical system
US10962766B2 · kind B2 · utility
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8References
20Claims
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Key dates
| Filing date | Jan 3, 2019 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Oct 11, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2027/0187
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A micro electro mechanical system is provided. The micro electro mechanical system includes a first part bonded to a second part by a structural adhesive interface. The structural adhesive interface includes a conductive structural adhesive portion, and a non-conductive structural adhesive portion at least partially surrounding the conductive structural adhesive portion. The conductive structural adhesive portion and the non-conductive structural adhesive portion have a thixotropy index greater than one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.