Methods of controlling a shape and size of solder joints of magnetic recording heads
US10964342B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2020 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Jun 2, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/455
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of controlling a shape and size of at least one solder joint of a magnetic recording head that includes a trailing surface and a plurality of bond pads, wherein each bond pad comprises a base layer comprising a top surface and a top edge, the method including the steps of forming at least one solder dam by covering a portion of the top surface of the base layer of at least one of the bond pads with a coating layer that comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads, thereby defining a coated portion and an uncoated portion of the base layer, and applying solder material to the uncoated portion of the base layer adjacent to the solder dam so that the coating layer constrains movement of the solder material beyond the uncoated portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.