Radar unit with thermal transfer via radome
US10965014B2 · kind B2 · utility
1Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Jun 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A radar unit includes a printed circuit board (PCB) supporting an integrated circuit (IC) chip. A radome is arranged over the IC chip. A spring engages the IC chip and the radome. The spring is configured to transfer thermal energy between the IC chip and the radome.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.