Comb pattern insert for wave solder pallets
US10965079B2 · kind B2 · utility
0Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Dec 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/044
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed herein relating to eliminating solder bridges between adjacent leads of small-pitch through-hole electrical components soldered to circuit boards using wave-soldering techniques. Several wave solder pallet insert patterns are disclosed. Each wave solder insert may include an insert pattern of peeling members is intended to eliminate solder bridges from various small-pitch component lead layouts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.