Micromechanical resonator and method for trimming micromechanical resonator
US10965267B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jun 29, 2017 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Jul 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/2447
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The present disclosure describes micromechanical resonator, a resonator element for the resonator, and a method for trimming the resonator. The resonator comprises a resonator element having a length, a width, and a thickness, where the length and the width define a plane of the resonator element. The resonator element comprises at least two regions (52, 53) in the plane of the resonator element, wherein the at least two regions have different thicknesses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.