Cover for an electronic circuit package
US10965376B2 · kind B2 · utility
0Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2018 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Dec 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.