Solid-state drive heat dissipation device
US10966345B2 · kind B2 · utility
4Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Jan 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.