Component mounting device
US10966358B2 · kind B2 · utility
1Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2014 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Oct 18, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.